KeynoteSessionWorkshopBreakSocial
09:00–09:30
Break
Registration & Welcome Coffee
Main Lobby (TBD)
09:30–10:15
Session
Opening Remarks: ICSEM-2027 and the Future of Semiconductors & Electronic Materials
Main Hall (TBD)
10:15–11:15
Keynote
Keynote Session: Semiconductor Materials for Next-Generation Devices
Main Hall (TBD)
11:15–11:30
Break
Morning Break
Networking Area (TBD)
11:30–12:30
Session
Technical Session: Crystal Growth, Wafer Materials & Substrates
Main Hall (TBD)
12:30–13:30
Break
Lunch Break
Dining Area (TBD)
13:30–14:45
Session
Technical Session: Thin Films, Deposition & Etching Processes
Main Hall (TBD)
14:45–15:00
Break
Afternoon Break
Networking Area (TBD)
15:00–16:15
Session
Technical Session: Dielectrics, Interconnects & Materials Interfaces
Main Hall (TBD)
16:15–16:30
Break
Short Break
Networking Area (TBD)
16:30–17:30
Panel
Panel Discussion: Materials Reliability and Manufacturing Scale-Up
Main Hall (TBD)
17:30–18:00
Session
Day 1 Wrap-Up & Networking
Main Hall (TBD)
March 10–12, 2027 · Amsterdam
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